Temperature control management of electronic device based on number of heat-emitting components in compartment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 1, 2023
Grant Date -
Jun 18, 2020
app pub date -
Jul 3, 2019
filing date -
Dec 14, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present disclosure includes systems and methods for controlling temperature in an electronic device. An electronic device includes a number of heat-emitting components, a plurality of compartments, and a processor. The processor is configured to identify a temperature in one of the compartments of the electronic device, determine whether the identified temperature in the one compartment exceeds a threshold for the one compartment, and in response to determining that the identified temperature for the one compartment exceeds the threshold, modify, based on the identified temperature, operation of a component of the number of heat-emitting components that is located in the one compartment to reduce the temperature in the one compartment.
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SAMSUNG ELECTRONICS CO LTD | SUWON-SI GYEONGGI-DO 16677 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Huang, Pengda | Allen, US | 9 | 79 |
# of filed Patents : 9 Total Citations : 79 | |||
Kanamangala, Ravindranath | Murphy, US | 4 | 2 |
# of filed Patents : 4 Total Citations : 2 | |||
Mo, Jianhua | Allen, US | 73 | 198 |
# of filed Patents : 73 Total Citations : 198 | |||
Ng, Boon Loong | Plano, US | 457 | 8737 |
# of filed Patents : 457 Total Citations : 8737 |
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