Dip molding composition, method of producing glove, and glove

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United States of America Patent

PATENT NO 11713401
APP PUB NO 20210221966A1
SERIAL NO

16477247

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a dip molding composition including, at least: an elastomer that contains a (meth)acrylonitrile-derived structural unit, an unsaturated carboxylic acid-derived structural unit, and a butadiene-derived structural unit in a polymer main chain; an epoxy crosslinking agent; water; and a pH modifier, in which dip molding composition the elastomer contains the (meth)acrylonitrile-derived structural unit in an amount of 20 to 40% by weight, the unsaturated carboxylic acid-derived structural unit in an amount of 1 to 10% by weight, and the butadiene-derived structural unit in an amount of 50 to 75% by weight, and the epoxy crosslinking agent includes an epoxy crosslinking agent containing an epoxy compound having three or more epoxy groups in one molecule and has a dissolution rate in water of 10 to 70% as determined by a specific measurement method.

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Patent Owner(s)

Patent OwnerAddress
MIDORI ANZEN CO LTD4-3 HIROO 5-CHOME SHIBUYA-KU TOKYO 150-8455

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enomoto, Norihide Tokyo, JP 30 102
Ogawa, Taichi Tokyo, JP 33 226
Shibasaki, Junji Tokyo, JP 7 71
Shibata, Kaname Tokyo, JP 4 3

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