Method and system for forming grooves in a board element and an associated panel
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United States of America Patent
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Aug 1, 2023
Grant Date -
Sep 10, 2020
app pub date -
Mar 4, 2020
filing date -
Mar 5, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A method for forming grooves in a board element. An exemplary method includes arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by rotating one or more cutting devices including a plurality of tooth elements configured to rotate around a rotational axis. A method further includes counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, includes arranging at least a portion of the board element between an obstruction element and the support member.
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