Semiconductor substrate support with multiple electrodes and method for making same
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United States of America Patent
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Aug 1, 2023
Grant Date -
May 12, 2022
app pub date -
Jan 25, 2022
filing date -
Nov 30, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C04B:LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREO....
- H05B:ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE ....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- F16B:DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL E....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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