Substrate treating apparatus and inkjet apparatus

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United States of America Patent

PATENT NO 11707944
SERIAL NO

17407936

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a substrate treating apparatus. The substrate treating apparatus may include a stage including an accommodation area, onto or from which a substrate is loaded or unloaded, and a treatment area, in which the substrate is treated, a liquid discharge head that supplies a treatment liquid to the substrate, and a liquid receiving part that receives the treatment liquid pre-discharged by the liquid discharge head in the treatment area.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTDCHUNGNAM SOUTH KOREA JEOLLANAM-DO

International Classification(s)

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  • 2021 Application Filing Year
  • B41M Class
  • 488 Applications Filed
  • 232 Patents Issued To-Date
  • 47.55 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Kwang Jun Daejeon, KR 5 0
Jang, Yoon-Ok Chungcheongnam-do, KR 3 0
Kim, Sung Ho Chungcheongnam-do, KR 253 1085
Lee, Hyun Min Gyeongsangnam-do, KR 44 30
Lee, Jun Seok Chungcheongnam-do, KR 109 742

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Patent Citation Ranking

  • 0 Citation Count
  • B41M Class
  • 0 % this patent is cited more than
  • 2 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges30859101 - 1011 - 20020406080100120140160180200220240260280300320340

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