Film deposition method and film deposition apparatus
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United States of America Patent
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Jul 18, 2023
Grant Date -
Sep 5, 2019
app pub date -
Feb 26, 2019
filing date -
Mar 2, 2018
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Abstract
A film deposition method uses a film deposition apparatus including a source gas supply part and a cleaning gas supply part. In the method, a source gas is adsorbed on a substrate by supplying the source gas from the source gas supply part without supplying a purge gas into the cleaning gas supply part. A reaction product is deposited on the substrate by supplying a reaction gas reactable with the source gas to the substrate on which the source gas is adsorbed without supplying the purge gas into the cleaning gas supply part.
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