Method for manufacturing a circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11700698
SERIAL NO

17686743

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Abstract

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A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

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Patent Owner(s)

Patent OwnerAddress
AVARY HOLDING (SHENZHEN) CO LIMITED27TH FLOOR BLOCK A AVARY TIME CENTER NO 2038 HAIXIU ROAD HAIBIN COMMUNITY XIN AN STREET SHENZHEN
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTDNO 18 TENGFEI ROAD QINHUANGDAO ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE HEBEI PROVINCE 066000

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Yan-Lu Shenzhen, CN 23 10
Wei, Hao-Yi New Taipei, TW 4 0

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