Semiconductor device and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11699731
APP PUB NO 20210066468A1
SERIAL NO

17003181

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Abstract

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According to at least one embodiment, a semiconductor device includes a plurality of insulating films adjacent to each other. A conductive film is provided between the plurality of insulating films. The conductive film includes molybdenum having a grain diameter substantially the same as a distance from an upper surface to a lower surface of the conductive film.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO 108-0023

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beppu, Takayuki Yokkaichi Mie, JP 12 9
Kitamura, Masayuki Yokkaichi Mie, JP 100 1192
Natori, Katsuaki Yokkaichi Mie, JP 76 819
Toyoda, Hiroshi Yokkaichi Mie, JP 90 876

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