In-situ fingerprinting for electrochemical deposition and/or electrochemical etching

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United States of America Patent

PATENT NO 11692282
APP PUB NO 20210017666A1
SERIAL NO

17015821

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Abstract

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Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

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Patent Owner(s)

Patent OwnerAddress
NOVA MEASURING INSTRUMENTS GMBHMORITZBURGER WEG 67 DRESDEN 01109

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Richter, Fred Dresden, DE 3 8
Schroeder, Norbert Dresden, DE 14 301
Stahl, Juerg Winterthur, CH 8 22

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