Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

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United States of America Patent

PATENT NO 11691389
APP PUB NO 20210079172A1
SERIAL NO

17109323

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Abstract

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The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO 105-7325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirayama, Yuya Tokyo, JP 10 0
Kakitani, Minoru Tokyo, JP 14 38
Kitajima, Takayo Tokyo, JP 3 0
Kushida, Keisuke Tokyo, JP 6 2
Shimizu, Hiroshi Tokyo, JP 514 5554
Tomioka, Kenichi Tokyo, JP 28 249

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