Electronic device and manufacturing method therefor

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United States of America Patent

PATENT NO 11689177
SERIAL NO

17406362

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Abstract

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An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTDKYOTO JAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Isao Nagaokakyo, JP 22 184
Ojima, Shigeo Nagaokakyo, JP 5 2
Sai, Koki Nagaokakyo, JP 10 19

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