Method and apparatus for removing particles from the surface of a semiconductor wafer

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United States of America Patent

PATENT NO 11688600
SERIAL NO

17541877

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Abstract

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A method for removing particles from a semiconductor wafer surface is disclosed. A liquid is placed on a surface of a semiconductor wafer on which particles may adhere. A light pulse is then applied to the surface of the semiconductor wafer through the liquid. The liquid containing the particles is then removed from the surface of the semiconductor wafer.

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Patent Owner(s)

Patent OwnerAddress
NCC NANO LLC12221 MERIT DRIVE THREE FOREST PLAZA SUITE DALLAS TX 75251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rose, David Alex Seoul, KR 2 0
Schroder, Kurt A Coupland, US 53 452

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