Ultra-fine nanocrystalline diamond precision cutting tool and manufacturing method therefor

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United States of America Patent

PATENT NO 11684981
APP PUB NO 20210016364A1
SERIAL NO

17043439

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An ultra-fine nanocrystalline diamond precision cutting tool and a manufacturing method therefor. A diamond cutter is made of a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick film having a thickness of 100-3000 microns, where 1 nanometer≤diamond grain size≤20 nanometers. In the manufacturing method, the growth of ultra-fine nanocrystalline diamond on a silicon substrate is accomplished by means of two steps of direct current hot cathode glow discharge chemical vapor deposition and hot filament chemical vapor deposition, then the silicon substrate is separated from the diamond to obtain a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick self-supporting film of ultra-fine nanocrystalline diamond is laser cut and then welded to a cutter body, and then by means of edging, rough grinding and fine grinding, an ultra-fine nanocrystalline diamond precision cutting tool is obtained.

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Patent Owner(s)

Patent OwnerAddress
NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING CHINESE ACADEMY OF SCIENCES315040 ZHEJIANG NINGBO SCIENCE AND TECHNOLOGY PARK ROAD NO 181 TORCH HOTEL THIRD FLOOR NINGBO CITY ZHEJIANG PROVINCE 315040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cao, Yang Zhejiang, CN 306 2907
Jiang, Nan Zhejiang, CN 202 1512
Li, He Zhejiang, CN 180 530
Wang, Bo Zhejiang, CN 734 4273
Yi, Jian Zhejiang, CN 17 47

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