Hybrid material post-CMP brushes and methods for forming the same
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United States of America Patent
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Jun 27, 2023
Grant Date -
Sep 17, 2020
app pub date -
Jun 2, 2020
filing date -
Sep 22, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.
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International Classification(s)
- A46B:BRUSHES
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B08B:CLEANING IN GENERAL; PREVENTION OF FOULING IN GENE....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- A46D:MANUFACTURE OF BRUSHES
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