Techniques for thermal management within optical subassembly modules and a heater device for laser diode temperature control
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United States of America Patent
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Jun 20, 2023
Grant Date -
Feb 10, 2022
app pub date -
Aug 6, 2020
filing date -
Aug 6, 2020
priority date (Note) -
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Abstract
The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.
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