Heat assisted flip chip bonding apparatus
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United States of America Patent
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Jun 20, 2023
Grant Date -
Dec 1, 2022
app pub date -
Nov 23, 2021
filing date -
Jun 1, 2021
priority date (Note) -
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Abstract
A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.
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