Module with built-in component and method for manufacturing the same
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United States of America Patent
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Jun 20, 2023
Grant Date -
Oct 29, 2020
app pub date -
Jul 8, 2020
filing date -
Jan 11, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A module includes components on an upper surface and a lower surface of a substrate, a second sealing resin layer laminated on the upper surface of the substrate, a first sealing resin layer on the lower surface of the substrate, and terminal blocks on the lower surface of the substrate. Each of the terminal blocks is formed by integrating a plurality of connection conductors, each of the plurality of connection conductors including a terminal portion and a substrate connecting portion formed by bending an end portion of the connection conductor, and each of the terminal blocks forms an external connection terminal of the module or functions as a shield wall for the components. Each of the terminal blocks 6 can be formed by mounting a terminal assembly onto the lower surface of the substrate, sealing the terminal assembly with a resin, and removing connecting portions.
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