Circuit board
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United States of America Patent
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Jun 13, 2023
Grant Date -
N/A
app pub date -
Feb 25, 2022
filing date -
Oct 13, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board includes a substrate, a plurality of contacts disposed on a surface of the substrate, and a solder mask. The contacts have a plurality of plating regions and a metal layer on the plating regions, and the plating regions have at least two different sizes. The solder mask covers the surface of the substrate and covers edges of the plating regions, in which topmost surfaces of the contacts are below a top surface of the solder mask, and a gap between the topmost surfaces of the contacts and the top surface of the solder mask is larger than 0 μm and is smaller than 5 μm.
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