Sensor integrated circuit with integrated coil and element in central region of mold material
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United States of America Patent
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Jun 13, 2023
Grant Date -
Sep 29, 2022
app pub date -
Jun 14, 2022
filing date -
Mar 20, 2012
priority date (Note) -
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Abstract
A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.
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