Film formation device and film formation method for metal plating film
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 13, 2023
Grant Date -
N/A
app pub date -
Dec 10, 2021
filing date -
Dec 15, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a device and a method for forming a metal plating film having a thick film thickness by a solid substitution-type electroless plating method. The present disclosure relates to a film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution-type electroless plating method, comprising: a conductive mounting base; a third metal; an insulating material; a microporous membrane; a plating bath chamber; and a pressing unit, wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and wherein the insulating material is installed between a base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C23C Class
- 0 % this patent is cited more than
- 2 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Dec 13, 2026 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 13, 2030 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 13, 2034 |