Component carrier and method of manufacturing the same
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United States of America Patent
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May 30, 2023
Grant Date -
Oct 15, 2020
app pub date -
Apr 6, 2020
filing date -
Apr 10, 2019
priority date (Note) -
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Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component including a terminal made of a first electrically conductive material and being embedded in the stack, a recess in the stack exposing at least a part of the terminal, an interface structure on the at least partially exposed terminal and an electrically conductive structure on the interface structure made of a second electrically conductive material.
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