Three-dimensional hierarchical layered porous copper and method for making the same
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United States of America Patent
Stats
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May 30, 2023
Grant Date -
Aug 11, 2022
app pub date -
Jun 10, 2021
filing date -
Feb 5, 2021
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a β′ phase and a γ phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermediate layer, and a second surface layer stacked in that order. The first surface layer includes a plurality of micron-scale pores and a plurality of first nanoscale pores. The intermediate layer includes a plurality of second nanoscale pores. The second surface layer includes the plurality of micron-scale pores and the plurality of first nanoscale pores.
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International Classification(s)
- 2021 Application Filing Year
- C22F Class
- 181 Applications Filed
- 65 Patents Issued To-Date
- 35.92 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C22F Class
- 0 % this patent is cited more than
- 2 Age
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