RFI free picture frame metal stiffener

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11658127
APP PUB NO 20200411448A1
SERIAL NO

16454423

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goh, Eng Huat Ayer Itam, MY 108 300
Koh, Boon Ping Seberang Jaya, MY 36 82
Lim, Min Suet Gulugor, MY 142 541
Sir, Jiun Hann Gelugor, MY 55 206
Song, Wil Choon Bayan Lepas, MY 27 70
Yong, Khang Choong Puchong, MY 60 139

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