Plasma processing method
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United States of America Patent
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May 23, 2023
Grant Date -
Dec 31, 2020
app pub date -
Jun 26, 2019
filing date -
Jun 26, 2019
priority date (Note) -
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Abstract
The invention provides a plasma processing method in which plasma etching is performed on a film to be etched by using a mask, the plasma processing method including: a deposition step of depositing a deposition film containing a boron element on the mask while a radio frequency power is supplied to a sample table on which a sample formed with the film to be etched is placed; and an etching step of etching the film to be etched by using plasma after the deposition step.
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