Method and device for measuring dimension of semiconductor structure

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United States of America Patent

PATENT NO 11656245
APP PUB NO 20220229087A1
SERIAL NO

17392430

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Abstract

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A method and device for measuring dimension of a semiconductor structure are provided. A probe of an Atomic Force Microscope (AFM) is controlled at first to move a first distance from a preset reference position to a top surface of a semiconductor structure to be measured in a direction perpendicular to the top surface of the semiconductor structure to be measured, then the probe is controlled to scan the surface of the semiconductor structure to be measured while keeping the first distance in a direction parallel to the top surface of the semiconductor structure to be measured, amplitudes of the probe at respective scanning points on the surface of the semiconductor structure to be measured are detected, and a Critical Dimension (CD) of the semiconductor structure to be measured is determined according to the amplitudes of the probe at respective scanning points on the surface of the semiconductor structure.

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Patent Owner(s)

Patent OwnerAddress
CHANGXIN MEMORY TECHNOLOGIES INCNO 388 XINGYE AVENUE AIRPORT INDUSTRIAL PARK ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA HEFEI CITY ANHUI 230000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Zheng Hefei, CN 308 1492

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