Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same
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United States of America Patent
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May 23, 2023
Grant Date -
Dec 17, 2020
app pub date -
Jun 12, 2020
filing date -
Jun 12, 2019
priority date (Note) -
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Abstract
An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.
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