Method of forming a thermal shield in a monolithic 3-d integrated circuit
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United States of America Patent
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Mar 14, 2023
Grant Date -
Jun 17, 2021
app pub date -
Mar 2, 2021
filing date -
Dec 21, 2018
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Abstract
A monolithic three-dimensional integrated circuit including a first device, a second device on the first device, and a thermal shield stack between the first device and the second device. The thermal shield stack includes a thermal retarder portion having a low thermal conductivity in a vertical direction, and a thermal spreader portion having a high thermal conductivity in a horizontal direction. The thermal shield stack of the monolithic three-dimensional integrated circuit includes only dielectric materials.
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