Ceramic metal circuit board and semiconductor device using the same
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United States of America Patent
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Feb 28, 2023
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N/A
app pub date -
Aug 21, 2019
filing date -
Mar 23, 2017
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Abstract
According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.
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