Low-temperature sinterable copper particle and method for producing sintered body by using the same
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United States of America Patent
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Feb 28, 2023
Grant Date -
Dec 3, 2020
app pub date -
Nov 29, 2017
filing date -
Nov 29, 2017
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Abstract
To provide novel low-temperature sinterable copper particles that can be sintered even at a low temperature of, for example, around 100° C. or less, and a method for producing a sintered body by using the same. The low-temperature sinterable copper particles according to the present invention are coated with a carboxylic acid, and a surface of the copper particle is oxidized so as to have a cuprous oxide fraction (Cu2O/(Cu+Cu2O)) in the copper particle of 4% by mass or less or so as to have an average coating thickness of cuprous oxide of 10 nm or less. The low-temperature sinterable copper particles are subjected to low-temperature firing in an atmosphere of 0.01 Pa or less.
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