Semiconductor device
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United States of America Patent
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Feb 21, 2023
Grant Date -
Aug 6, 2020
app pub date -
Apr 21, 2020
filing date -
Mar 9, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.
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