Wafer testing device of flip chip VCSEL
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 21, 2023
Grant Date -
Jan 14, 2021
app pub date -
Jun 21, 2020
filing date -
Jul 9, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention discloses a wafer testing device of flip chip VCSEL for testing a wafer having a plurality of light emitting units. The wafer testing device of flip chip VCSEL comprises a wafer testing carrier and a flexible conductive layer. The wafer testing carrier has a first surface. A plurality of testing portions are disposed on the first surface. The flexible conductive layer, detachably disposed on the first surface, are conductive in vertical direction and insulated in horizontal direction. Wherein the wafer is disposed on the flexible conductive layer, and each light emitting unit is electrically connected with one of the testing portions in vertical direction through the flexible conductive layer while testing the wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully