Adaptive cavity thickness control for micromachined ultrasonic transducer devices
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United States of America Patent
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Feb 21, 2023
Grant Date -
Aug 27, 2020
app pub date -
Nov 14, 2019
filing date -
Feb 25, 2019
priority date (Note) -
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Abstract
A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.
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