Soldering apparatus, computer-readable medium, and soldering method
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United States of America Patent
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Feb 14, 2023
Grant Date -
May 30, 2019
app pub date -
Nov 30, 2018
filing date -
Nov 30, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.
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