Indirect laser brazing of SiC/SiC CMCs for manufacturing and repair
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United States of America Patent
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Feb 14, 2023
Grant Date -
Jul 22, 2021
app pub date -
Jan 16, 2020
filing date -
Jan 16, 2020
priority date (Note) -
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Abstract
A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.
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