Multilayer screen printing stencil
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United States of America Patent
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Feb 7, 2023
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N/A
app pub date -
Sep 3, 2020
filing date -
Sep 3, 2020
priority date (Note) -
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Abstract
A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.
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