Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11575816
APP PUB NO 20220286592A1
SERIAL NO

17824415

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Abstract

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A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

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Patent Owner(s)

Patent OwnerAddress
NINGBO SUNNY OPOTECH CO LTDNINGBO ZHEJIANG 315400

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Zhenyu Ningbo, CN 152 625
Deng, Zilong Ningbo, CN 22 102
Guo, Nan Ningbo, CN 131 570
Tanaka, Takehiko Ningbo, CN 164 1043
Wang, Mingzhu Ningbo, CN 171 656
Zhao, Bojie Ningbo, CN 157 607

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