Semiconductor device
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United States of America Patent
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Feb 7, 2023
Grant Date -
Jul 8, 2021
app pub date -
Mar 24, 2021
filing date -
Mar 15, 2019
priority date (Note) -
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Abstract
A semiconductor device according to embodiments includes: a first conductivity-type first semiconductor layer set to a first potential; a second conductivity-type second semiconductor layer stacked on the first semiconductor layer and set to a second potential; an interlayer insulating film disposed on a main surface of the second semiconductor layer; a resistor disposed above the first semiconductor layer while interposing the second semiconductor layer and the interlayer insulating film therebetween; and a terminal electrically connected to the second semiconductor layer.
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