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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD	OSAKA JAPAN OSAKA

International Classification(s)

• C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
• D21J:FIBREBOARD; MANUFACTURE OF ARTICLES FROM CELLULOSI....
• B27N:MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR ....
• C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
• C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Naito, Shigeki	Hyogo, JP	6	3
Ueyama, Yoshio	Wakayama, JP	1	0

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Aug 7, 2026
7.5 Year Payment	$3600.00	$1800.00	$900.00	Aug 7, 2030
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Aug 7, 2034

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 07, 2023	US,11572491,B2   US11572491B2	GRANTED PATENT AS SECOND PUBLICATION
June 18, 2020	US,20200190366,A1   US20200190366A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 11572491

Adhesive for heat press molding, wooden board, and manufacturing methods thereof

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