Semiconductor packaging structure and method of fabricating same
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United States of America Patent
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Jan 31, 2023
Grant Date -
Sep 17, 2020
app pub date -
Jun 21, 2019
filing date -
Mar 15, 2019
priority date (Note) -
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Abstract
A semiconductor packaging structure manufactured in a manner which does not leave the chip damaged or susceptible to damage upon the removal of temporary manufacturing supports includes at least one electrical conductor, at least one conductive layer, a chip, and a colloid. The chip is spaced from the conductive layer, the electrical conductor is disposed between the conductive layer and the chip and electrically connects the conductive layer to the chip. The colloid covers all outer surfaces of the chip. A method of fabricating such a semiconductor packaging structure is also provided.
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