Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment
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United States of America Patent
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Jan 31, 2023
Grant Date -
Jan 21, 2021
app pub date -
Oct 6, 2020
filing date -
Jul 27, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.
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