Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same

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United States of America Patent

PATENT NO 11561470
APP PUB NO 20200110337A1
SERIAL NO

16495745

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof. The negative type photosensitive resin composition includes an alkali-soluble resin (A), a radical polymerizable compound (B), a photo initiator (C1), and a black colorant (Da); the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); and the radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2).

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Patent Owner(s)

  • TORAY INDUSTRIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyoshi, Kazuto Otsu, JP 41 202
Tanigaki, Yugo Otsu, JP 19 85

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