Method and laser arrangement for fusing a solder material deposit by means of laser energy
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United States of America Patent
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Jan 17, 2023
Grant Date -
Jul 22, 2021
app pub date -
Feb 14, 2018
filing date -
Feb 28, 2017
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Abstract
The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.
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