Tool-less M.2 device carrier with grounding and thermal flow
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United States of America Patent
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Jan 10, 2023
Grant Date -
N/A
app pub date -
Nov 17, 2020
filing date -
Jul 23, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.
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