Substrate with embedded active thermoelectric cooler

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11551995
APP PUB NO 20190131209A1
SERIAL NO

16160442

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Abstract

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The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric cooler includes a top-side plate with an element-contact pad and a bottom-side plate. The element-contact pad is on a top surface of the top-side plate, which faces a same direction as a top surface of the substrate body and is exposed to the external space of the substrate body. The bottom-side plate is below the top-side plate and close to a bottom surface of the top-side plate. Herein, the element-contact pad is configured to accommodate attachment of a heat-generating electrical element. The top-side plate is configured to change temperature of the heat-generating electrical element, and the bottom-side plate is configured to transfer heat to or absorb heat from the bottom surface of the substrate body.

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Patent Owner(s)

Patent OwnerAddress
QORVO US INC7628 THORNDIKE ROAD GREENSBORO NC 27409

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lear, Kelly M Longwood, US 16 11
Nair, Deepukumar M Lake Mary, US 19 170
Nelson, Bradford Redwood City, US 1 1
Railkar, Tarak A Plano, US 32 242
Woods, Mark C Richardson, US 10 377

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