Solution-based deposition method for preparing semiconducting thin films via dispersed particle self-assembly at a liquid-liquid interface
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United States of America Patent
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Jan 10, 2023
Grant Date -
Oct 7, 2021
app pub date -
Aug 3, 2018
filing date -
Aug 3, 2018
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Abstract
A method for preparing a semiconducting thin film and device for carrying out the method, wherein the method includes: (1) providing a liquid-liquid interface; (2) providing at least one layered semiconductor material or its precursor(s) in the form of particles in a solvent in the form of a dispersion; (3) injecting the dispersion at the liquid-liquid interface, in order to obtain an assembly of semiconductor/semiconductor precursor particles; (4) bringing the assembly of into contact with a flexible substrate; and (5) applying a surface pressure to the dispersion to obtain a particle film of semiconductor/semiconductor precursor on the substrate, wherein the first solvent has a higher density than the second solvent.
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