Attachment of stress sensitive integrated circuit dies

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11548781
APP PUB NO 20200361764A1
SERIAL NO

16759659

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Abstract

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A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

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Patent Owner(s)

Patent OwnerAddress
SCIOSENSE B V5656 AE EINDHOVEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Besling, Willem Frederik Adrianus Eindhoven, NL 46 634
Pijnenburg, Remco Henricus Wilhelmus Hoogeloon, NL 36 288
Tak, Coen Waalre, NL 3 26
Van, Der Avoort Casper Waalre, NL 28 141
Wunnicke, Olaf Eindhoven, NL 34 595

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