Injection molding material for magnesium thixomolding

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United States of America Patent

PATENT NO 11548066
SERIAL NO

17207797

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Abstract

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An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATIONTOKYO 163-0811

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuta, Tadao Kurashiki, JP 13 0
Hideshima, Yasutoshi Nagano, JP 33 84
Nakamura, Hidefumi Aomori, JP 52 169
Ozaki, Koichi Okayama, JP 43 775

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