Method for removing wire-form objects, device for removing wire-form objects, and method for processing electronic/electrical apparatus component scrap
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 10, 2023
Grant Date -
Feb 11, 2021
app pub date -
Jan 30, 2019
filing date -
Jan 31, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully