Encapsulation methods for fluid-communicating magnetoelastic sensors
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United States of America Patent
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Jan 3, 2023
Grant Date -
Oct 8, 2020
app pub date -
Apr 6, 2020
filing date -
Apr 5, 2019
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Abstract
Encapsulation packages for stent-deployable monitoring devices formed of resonator sensors and allowing for magnetic biasing elements that exhibit a targeted impact on the mechanical characteristics of a stent are provided. Encapsulation packages are formed of different types and include a longitudinal shield and curved end on profile for aligning the shield within the deployable stent, the shield having perforations such that a resonator can be positioned adjacent the perforations for allowing particulate within the stent to collect and be measured by the resonator during deployment.
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