System and method for bonding a cable to a substrate using a die bonder

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United States of America Patent

PATENT NO 11540399
SERIAL NO

17167955

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Importance

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Abstract

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A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

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Patent Owner(s)

Patent OwnerAddress
HRL LABORATORIES LLC3011 MALIBU CANYON ROAD MALIBU CA 90265-4799

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brewer, Peter Westlake Village, US 4 3
Lopez, Aurelio Malibu, US 5 10
Patterson, Pamela R Los Angeles, US 38 609

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